Aug 24, 2021 (The Expresswire) -- Global "3D TSV and 2.5D Market" research analysis is provided on major factors such as consumer needs and changes observed in them over time, market sales in terms of value and volume, emerging opportunities, market growth trends, factors driving this market, threats associated with them and market performance of key vendors along with key regions. Industry experts project 3D TSV and 2.5D market to grow at a CAGR of during the period.
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About 3D TSV and 2.5D Market:
The global 3D TSV and 2.5D market is expected to project a growth rate of 35.2% during the forecast period (2018 - 2023).
Connected devices and other wireless technologies like Wi-Fi and Bluetooth, are some of the features integrated in smart gadgets and devices for communicating with other devices. Several integrated circuits need to be incorporated in a single chip module for reducing the board space and cost. Miniaturization of electronic devices and the rapid growth of smartphones and tablets are also expected to influence the demand of the market.
Expanding Market for Smartphones, Tablets, and Gaming Devices
Advanced transformations of the consumer electronics require manufacturers to improve the offerings in terms of design, processing power, power consumption, and user interface, frequently. Such upgrades in consumer electronics will require the use of robust technology. 3D TSV is the core of integrated chip packaging on a nanometer scale ensuring robust hardware for technology. Shipments of smartphones is expected to reach 2 billion units by 2020, majorly due to the availability of low-cost smartphones in developing nations, such as China and India.
Asia-Pacific to Occupy a Significant Market Share
Countries, like China, Japan, South Korea, Indonesia, Singapore, and Australia have recorded high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, which a key source of demand for 3D TSV and 2.5D market in the region. The rising popularity of smartphones and demand for new memory technologies has increased the growth of computationally intensive consumer electronics, thereby creating a wide range of opportunities in this region. Asia-Pacific is one of the most active manufacturing hubs in the world.
Key Developments in the Market
â¢ March 2017 - Advanced Semiconductor Engineering, Inc., and Cadence Design Systems, Inc., announced they have collaborated to release a System-in-Package (SiP) EDA solution, that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages.
Major Players - TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, SAMSUNG ELECTRONICS CO. LTD, TOSHIBA CORP., PURE STORAGE INC., ADVANCED SEMICONDUCTOR ENGINEERING INC., AMKOR TECHNOLOGY, UNITED MICROELECTRONICS CORP., STMICROELECTRONICS NV, BROADCOM LTD, INTEL CORPORATION, JIANGSU CHANGING ELECTRONICS TECHNOLOGY CO. LTD, amongst others.
Reasons to Purchase this Report
â¢ Impact of growing demand for smartphones and tablets.â¢ Analyzing various perspectives of the market with the help of Porterâs five forces analysis.â¢ Growth of various products such as - MEMS, Sensors, and Optpelectronics.â¢ Regional analysis of the market.â¢ Identify the latest developments, market shares, and strategies employed by the major market players.â¢ 3 months analyst support, along with the Market Estimate sheet (in excel).
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List Of TOP KEY PLAYERS in 3D TSV and 2.5D Market Report are:-
● Taiwan Semiconductor Manufacturing Company Limited ● Samsung Electronics Co. Ltd ● Toshiba Corp. ● Pure Storage Inc. ● Advanced Semiconductor Engineering Inc. ● Amkor Technology ● United Microelectronics Corp. ● STMicroelectronics NV ● And Others
3D TSV and 2.5D market report explores the international and Chinese major 3D TSV and 2.5D players in detail. In this part, the report presents the company profile, product specifications, capacity, production value, and 2015-2021 3D TSV and 2.5D market shares for each company.
After the basic information, the report sheds light on the production. Production plants, their capacities, global production, and revenue are studied. Also, the 3D TSV and 2.5D Sales growth in various regions and RandD status are also covered.
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Global 3D TSV and 2.5D Market 2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.